Table of Contents
1 RESEARCH SCOPE
1.1 Research Product Definition
1.2 Research Segmentation
1.2.1 Product Type
1.2.2 Main product Type of Major Players
1.3 Demand Overview
1.4 Research Methodology
2 GLOBAL HIGH TEMPERATURE SOLDER PASTES INDUSTRY
2.1 Summary about High Temperature Solder Pastes Industry
2.2 High Temperature Solder Pastes Market Trends
2.2.1 High Temperature Solder Pastes Production & Consumption Trends
2.2.2 High Temperature Solder Pastes Demand Structure Trends
2.3 High Temperature Solder Pastes Cost & Price
3 MARKET DYNAMICS
3.1 Manufacturing & Purchasing Behavior in 2020
3.2 Market Development under the Impact of COVID-19
3.2.1 Drivers
3.2.2 Restraints
3.2.3 Opportunity
3.2.4 Risk
4 GLOBAL MARKET SEGMENTATION
4.1 Region Segmentation (2017 to 2021f)
4.1.1 North America (U.S., Canada and Mexico)
4.1.2 Europe (Germany, UK, France, Italy, Rest of Europe)
4.1.3 Asia-Pacific (China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific)
4.1.4 South America (Brazil,, Argentina, Rest of Latin America)
4.1.5 Middle East and Africa (GCC, North Africa, South Africa, Rest of Middle East and Africa)
4.2 Product Type Segmentation (2017 to 2021f)
4.2.1 Rosin Based Pastes
4.2.2 Water Soluble Pastes
4.2.3 Others
4.3 Consumption Segmentation (2017 to 2021f)
4.3.1 SMT Assembly
4.3.2 Semiconductor Packaging
5 NORTH AMERICA MARKET SEGMENT
5.1 Region Segmentation (2017 to 2021f)
5.1.1 U.S.
5.1.2 Canada
5.1.3 Mexico
5.2 Product Type Segmentation (2017 to 2021f)
5.2.1 Rosin Based Pastes
5.2.2 Water Soluble Pastes
5.2.3 Others
5.3 Consumption Segmentation (2017 to 2021f)
5.3.1 SMT Assembly
5.3.2 Semiconductor Packaging
5.4 Impact of COVID-19 in North America
6 EUROPE MARKET SEGMENTATION
6.1 Region Segmentation (2017 to 2021f)
6.1.1 Germany
6.1.2 UK
6.1.3 France
6.1.4 Italy
6.1.5 Rest of Europe
6.2 Product Type Segmentation (2017 to 2021f)
6.2.1 Rosin Based Pastes
6.2.2 Water Soluble Pastes
6.2.3 Others
6.3 Consumption Segmentation (2017 to 2021f)
6.3.1 SMT Assembly
6.3.2 Semiconductor Packaging
6.4 Impact of COVID-19 in Europe
7 ASIA-PACIFIC MARKET SEGMENTATION
7.1 Region Segmentation (2017 to 2021f)
7.1.1 China
7.1.2 India
7.1.3 Japan
7.1.4 South Korea
7.1.5 Southeast Asia
7.1.6 Australia
7.1.7 Rest of Asia Pacific
7.2 Product Type Segmentation (2017 to 2021f)
7.2.1 Rosin Based Pastes
7.2.2 Water Soluble Pastes
7.2.3 Others
7.3 Consumption Segmentation (2017 to 2021f)
7.3.1 SMT Assembly
7.3.2 Semiconductor Packaging
7.4 Impact of COVID-19 in Europe
8 SOUTH AMERICA MARKET SEGMENTATION
8.1 Region Segmentation (2017 to 2021f)
8.1.1 Brazil
8.1.2 Argentina
8.1.3 Rest of Latin America
8.2 Product Type Segmentation (2017 to 2021f)
8.2.1 Rosin Based Pastes
8.2.2 Water Soluble Pastes
8.2.3 Others
8.3 Consumption Segmentation (2017 to 2021f)
8.3.1 SMT Assembly
8.3.2 Semiconductor Packaging
8.4 Impact of COVID-19 in Europe
9 MIDDLE EAST AND AFRICA MARKET SEGMENTATION
9.1 Region Segmentation (2017 to 2021f)
9.1.1 GCC
9.1.2 North Africa
9.1.3 South Africa
9.1.4 Rest of Middle East and Africa
9.2 Product Type Segmentation (2017 to 2021f)
9.2.1 Rosin Based Pastes
9.2.2 Water Soluble Pastes
9.2.3 Others
9.3 Consumption Segmentation (2017 to 2021f)
9.3.1 SMT Assembly
9.3.2 Semiconductor Packaging
9.4 Impact of COVID-19 in Europe
10 COMPETITION OF MAJOR PLAYERS
10.1 Brief Introduction of Major Players
10.1.1 FCT Solder
10.1.2 Indium Corporation
10.1.3 Nordson Corporation
10.1.4 Interflux Electronics
10.1.5 Kester
10.1.6 Inventec
10.1.7 Shenzhen Bright
10.2 High Temperature Solder Pastes Sales Date of Major Players (2017-2020e)
10.2.1 FCT Solder
10.2.2 Indium Corporation
10.2.3 Nordson Corporation
10.2.4 Interflux Electronics
10.2.5 Kester
10.2.6 Inventec
10.2.7 Shenzhen Bright
10.3 Market Distribution of Major Players
10.4 Global Competition Segmentation
11 MARKET FORECAST
11.1 Forecast by Region
11.2 Forecast by Demand
11.3 Environment Forecast
11.3.1 Impact of COVID-19
11.3.2 Geopolitics Overview
11.3.3 Economic Overview of Major Countries
12 REPORT SUMMARY STATEMENT