DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang
Table of Contents
1 RESEARCH SCOPE
1.1 Research Product Definition
1.2 Research Segmentation
1.2.1 Product Type
1.2.2 Main product Type of Major Players
1.3 Demand Overview
1.4 Research Methodology
2 GLOBAL ELECTRONIC PACKAGING MATERIALS INDUSTRY
2.1 Summary about Electronic Packaging Materials Industry
2.2 Electronic Packaging Materials Market Trends
2.2.1 Electronic Packaging Materials Production & Consumption Trends
2.2.2 Electronic Packaging Materials Demand Structure Trends
2.3 Electronic Packaging Materials Cost & Price
3 MARKET DYNAMICS
3.1 Manufacturing & Purchasing Behavior in 2020
3.2 Market Development under the Impact of COVID-19
3.2.1 Drivers
3.2.2 Restraints
3.2.3 Opportunity
3.2.4 Risk
4 GLOBAL MARKET SEGMENTATION
4.1 Region Segmentation (2017 to 2021f)
4.1.1 North America (U.S., Canada and Mexico)
4.1.2 Europe (Germany, UK, France, Italy, Rest of Europe)
4.1.3 Asia-Pacific (China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific)
4.1.4 South America (Brazil,, Argentina, Rest of Latin America)
4.1.5 Middle East and Africa (GCC, North Africa, South Africa, Rest of Middle East and Africa)
4.2 Product Type Segmentation (2017 to 2021f)
4.2.1 Metal Packages
4.2.2 Plastic Packages
4.2.3 Ceramic Packages
4.3 Consumption Segmentation (2017 to 2021f)
4.3.1 Semiconductor & IC
4.3.2 PCB
4.3.3 Others
5 NORTH AMERICA MARKET SEGMENT
5.1 Region Segmentation (2017 to 2021f)
5.1.1 U.S.
5.1.2 Canada
5.1.3 Mexico
5.2 Product Type Segmentation (2017 to 2021f)
5.2.1 Metal Packages
5.2.2 Plastic Packages
5.2.3 Ceramic Packages
5.3 Consumption Segmentation (2017 to 2021f)
5.3.1 Semiconductor & IC
5.3.2 PCB
5.3.3 Others
5.4 Impact of COVID-19 in North America
6 EUROPE MARKET SEGMENTATION
6.1 Region Segmentation (2017 to 2021f)
6.1.1 Germany
6.1.2 UK
6.1.3 France
6.1.4 Italy
6.1.5 Rest of Europe
6.2 Product Type Segmentation (2017 to 2021f)
6.2.1 Metal Packages
6.2.2 Plastic Packages
6.2.3 Ceramic Packages
6.3 Consumption Segmentation (2017 to 2021f)
6.3.1 Semiconductor & IC
6.3.2 PCB
6.3.3 Others
6.4 Impact of COVID-19 in Europe
7 ASIA-PACIFIC MARKET SEGMENTATION
7.1 Region Segmentation (2017 to 2021f)
7.1.1 China
7.1.2 India
7.1.3 Japan
7.1.4 South Korea
7.1.5 Southeast Asia
7.1.6 Australia
7.1.7 Rest of Asia Pacific
7.2 Product Type Segmentation (2017 to 2021f)
7.2.1 Metal Packages
7.2.2 Plastic Packages
7.2.3 Ceramic Packages
7.3 Consumption Segmentation (2017 to 2021f)
7.3.1 Semiconductor & IC
7.3.2 PCB
7.3.3 Others
7.4 Impact of COVID-19 in Europe
8 SOUTH AMERICA MARKET SEGMENTATION
8.1 Region Segmentation (2017 to 2021f)
8.1.1 Brazil
8.1.2 Argentina
8.1.3 Rest of Latin America
8.2 Product Type Segmentation (2017 to 2021f)
8.2.1 Metal Packages
8.2.2 Plastic Packages
8.2.3 Ceramic Packages
8.3 Consumption Segmentation (2017 to 2021f)
8.3.1 Semiconductor & IC
8.3.2 PCB
8.3.3 Others
8.4 Impact of COVID-19 in Europe
9 MIDDLE EAST AND AFRICA MARKET SEGMENTATION
9.1 Region Segmentation (2017 to 2021f)
9.1.1 GCC
9.1.2 North Africa
9.1.3 South Africa
9.1.4 Rest of Middle East and Africa
9.2 Product Type Segmentation (2017 to 2021f)
9.2.1 Metal Packages
9.2.2 Plastic Packages
9.2.3 Ceramic Packages
9.3 Consumption Segmentation (2017 to 2021f)
9.3.1 Semiconductor & IC
9.3.2 PCB
9.3.3 Others
9.4 Impact of COVID-19 in Europe
10 COMPETITION OF MAJOR PLAYERS
10.1 Brief Introduction of Major Players
10.1.1 DuPont
10.1.2 Evonik
10.1.3 EPM
10.1.4 Mitsubishi Chemical
10.1.5 Sumitomo Chemical
10.1.6 Mitsui High-tec
10.1.7 Tanaka
10.1.8 Shinko Electric Industries
10.1.9 Panasonic
10.1.10 Hitachi Chemical
10.1.11 Kyocera Chemical
10.1.12 Gore
10.1.13 BASF
10.1.14 Henkel
10.1.15 AMETEK Electronic
10.1.16 Toray
10.1.17 Maruwa
10.1.18 Leatec Fine Ceramics
10.1.19 NCI
10.1.20 Chaozhou Three-Circle
10.1.21 Nippon Micrometal
10.1.22 Toppan
10.1.23 Dai Nippon Printing
10.1.24 Possehl
10.1.25 Ningbo Kangqiang
10.2 Electronic Packaging Materials Sales Date of Major Players (2017-2020e)
10.2.1 DuPont
10.2.2 Evonik
10.2.3 EPM
10.2.4 Mitsubishi Chemical
10.2.5 Sumitomo Chemical
10.2.6 Mitsui High-tec
10.2.7 Tanaka
10.2.8 Shinko Electric Industries
10.2.9 Panasonic
10.2.10 Hitachi Chemical
10.2.11 Kyocera Chemical
10.2.12 Gore
10.2.13 BASF
10.2.14 Henkel
10.2.15 AMETEK Electronic
10.2.16 Toray
10.2.17 Maruwa
10.2.18 Leatec Fine Ceramics
10.2.19 NCI
10.2.20 Chaozhou Three-Circle
10.2.21 Nippon Micrometal
10.2.22 Toppan
10.2.23 Dai Nippon Printing
10.2.24 Possehl
10.2.25 Ningbo Kangqiang
10.3 Market Distribution of Major Players
10.4 Global Competition Segmentation
11 MARKET FORECAST
11.1 Forecast by Region
11.2 Forecast by Demand
11.3 Environment Forecast
11.3.1 Impact of COVID-19
11.3.2 Geopolitics Overview
11.3.3 Economic Overview of Major Countries
12 REPORT SUMMARY STATEMENT